z z z z applications low current rectification z z z z features 1) small surface mounting type. 2) low i r . (i r =70na typ.) 3) high reliability. z z z z construction silicon epitaxial planar z z z z absolute maximum ratings (ta = 25 c) parameter symbol limits unit peak reverse voltage v rm v dc reverse voltage v r v mean rectifying current i o 0.1 a peak forward surge current ? 1a 125 c storage temperature c 45 40 junction temperature i fsm ? 40 ~ + 125 tj tstg ? 60hz for 1 z z z z electrical characteristics (ta = 25 c) note) esd sensitive product handling required. parameter symbol min. typ. max. unit conditions forward voltage v f ? 0.45 v i f = 10ma reverse current i r ? 1 av r = 10v capacitance between terminals ? 6.0 ? pf v r = 10v, f = 1mhz c t ? ? ? ? ? surface mount schottky diode leshan radio company, ltd. 2 anode 1 cathode sod -3 23 leshan radio company, ltd. ? device marking and ordering information device marking shipping lrb500v-40t1g 5 3000/tape&reel lrb500v-40t3g 5 10000/tape&reel lrb500v-40t1g we declare that the material of product compliance with rohs requirements. 1 2 rev.o 1/3
z z z z electrical characteristic curves (ta = 25 c) 0 0.1 1000 1 10 100 forward current : i f ( ma) forward voltage : v f ( v) 0.1 0.2 0.3 0.4 0.5 0.6 0.7 fig. 1 forward characteristics 125 c ? 25 c 75 c 25 c 0 reverse current : r ( a) reverse voltage : v r ( v) 0.01 0.1 1 10 100 1000 10000 40 10 20 30 fig. 2 reverse characteristics 125 c 75 c 25 c 0 10 1 100 5 101520253035 capacitance between terminals : c t ( pf) reverse voltage : v r ( v) fig. 3 capacitance between terminals characteristics 0 0 20 40 60 80 100 25 50 75 100 125 io current (%) ambient temperature : ta ( c ) fig. 4 derating curve (mounting on glass epoxy pcbs) leshan radio company, ltd. lrb500v-40t1g leshan radio company, ltd. rev.o 2/3
sod - 323 lrb500v-40t1g leshan radio company, ltd. 1/6 rev.o 3/3 h e notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeters. 3. lead thickness specified per l/f drawing with solder plating. 4. dimensions a and b do not include mold flash, protrusions or gate burrs. 5. dimension l is measured from end of radius. note 3 d 1 2 b e a3 a1 a c note 5 l 1.60 0.063 0.63 0.025 0.83 0.033 2.85 0.112 h e dim min nom max millimeters a 0.80 0.90 1.00 a1 0.00 0.05 0.10 a3 0.15 ref b 0.25 0.32 0.4 c 0.089 0.12 0.177 d 1.60 1.70 1.80 e 1.15 1.25 1.35 0.08 2.30 2.50 2.70 l 0.031 0.035 0.040 0.000 0.002 0.004 0.006 ref 0.010 0.012 0.016 0.003 0.005 0.007 0.062 0.066 0.070 0.045 0.049 0.053 0.003 0.090 0.098 0.105 min nom max inches soldering footprint*
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